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This application report presents an introduction to the CAN fundamentals, operating principles, and the implementation of a basic CAN bus with TI's CAN ...
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ABSTRACT. The PowerPAD™ thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size device package.
This application report details some of the features available in different MSP device families and considerations that can be taken to add additional layers of ...
ABSTRACT. The TPA324x and TPA325x (TPA3244, TPA3245, TPA3250, TPA3251, TPA3255) Class-D audio amplifier families deliver high audio performance with less ...
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ABSTRACT. ANSI TIA/EIA-422 and TIA/EIA-485 standards, commonly known as RS-422 and RS-485, respectively, specify balanced data-transmission schemes for ...
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TI's SimpleLink™ platform offers the broadest portfolio of 32-bit Arm-based micro- controllers (MCUs) with industry-leading features including low power and ...
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Maps the data → octets → frames consisting of multiple octets. • Adds optional control bits to samples if needed. • Distinguishes the possible combinations of ...
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