This application report presents an introduction to the CAN fundamentals, operating principles, and the implementation of a basic CAN bus with TI's CAN ...
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ABSTRACT. The PowerPAD™ thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size device package.
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This application report details some of the features available in different MSP device families and considerations that can be taken to add additional layers of ...
TI's LDC devices measure the inductance by measuring the resonant frequency of a sensor, and so the. LDC can be considered a frequency measurement version of an ...
This application report explains the link between the load-step response and the loop response of a given circuit. Based on this relationship, this document ...
ABSTRACT. The TPA324x and TPA325x (TPA3244, TPA3245, TPA3250, TPA3251, TPA3255) Class-D audio amplifier families deliver high audio performance with less ...
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All of the antenna reference designs available on www.ti.com/lpw are presented including the Antenna Development Kit. [29]. The last section in this document ...
TI's SimpleLink™ platform offers the broadest portfolio of 32-bit Arm-based micro- controllers (MCUs) with industry-leading features including low power and ...
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